In this work, we report on a single-pass method for cutting 250-μm thick Z-cut quartz plates using 200 fs laser pulses at the wavelength of 1030 nm. In particular, we delve into the influence of the process parameters, i.e. laser repetition rate, scan speed and pulse energy, on the generation of a controlled stress-induced fracture which ultimately leads to the final cut. Processing above a certain threshold pulse energy caused significant damage, resulting in poor quality cuts. Whereas, a correct combination of these parameters led to a flat and almost defect-free cut edges, in a single pass.

Single-pass direct laser cutting of quartz by IR femtosecond pulses

Gaudiuso C.;Volpe A.;Ancona A.
2021-01-01

Abstract

In this work, we report on a single-pass method for cutting 250-μm thick Z-cut quartz plates using 200 fs laser pulses at the wavelength of 1030 nm. In particular, we delve into the influence of the process parameters, i.e. laser repetition rate, scan speed and pulse energy, on the generation of a controlled stress-induced fracture which ultimately leads to the final cut. Processing above a certain threshold pulse energy caused significant damage, resulting in poor quality cuts. Whereas, a correct combination of these parameters led to a flat and almost defect-free cut edges, in a single pass.
2021
9781510641839
9781510641846
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11586/372687
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